Often regarded as a single inline pin package, a single inline package may be (SIPP).

Multiple resistors and RAM chips with a standard pin have been packaged using SIPs. SIPs jointly place RAM chips on a small board using either the surface mounting device process or the DIP process. A single row of pin leads that connect to a specific socket on a system or a system-expansion board are included in the panel only. Usually, SIPs are connected with memory units. SIPs typically consist of a standard maximum I/O count of 24, but with smaller package expenditures, as opposed to DIPs, which have a typical maximum I/O count of 64.

Many small-form SIPs are common-value component parallel-array systems such as resistor arrays, diodes, etc. Hybrid systems, such as oscillators, clocks, etc. are also large-form SIPs. The SIP body is made of either ceramic or plastic, with a lead count normally varying from four to 64. Three SIP forms are available: molded, conformal coated and uncoated.

We can offer a wide range of SIP DC/DC converters please view the range below. Working in partnership with leading technology suppliers including Cincon, Artesyn, Minmax and P-Duke we can easily tailor a solution to meet almost every requirement.

For unrivalled technical and commercial engineering support please contact us today on 01480 412233 to see how we can help you find the perfect power conversion solution.

SIP Package (medium-large)

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